WSF

www.vishay.com

Vishay Dale

Revision: 08-Jun-2020

2

Document Number: 30104

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS

Note

• WSF2012 has been obsoleted; PTN-DR-00013-2018 Rev. 0 - July 20, 2018. WSF2515 and WSF4527 sizes are not affected

Notes

• Embossed carrier tape per EIA-481

• WSF2012 has been obsoleted; PTN-DR-00013-2018 Rev. 0 - July 20, 2018. WSF2515 and WSF4527 sizes are not affected

W

L

T

H

W

1

l

a

b

MODEL

DIMENSIONS in inches (millimeters)

LH

T

W

WSF2515

0.250 ± 0.020

(6.35 ± 0.508)

0.110 ± 0.015

(2.79 ± 0.381)

0.045 ± 0.010

(1.14 ± 0.254)

0.150 ± 0.005

(3.81 ± 0.127)

0.098 ± 0.005

(2.49 ± 0.127)

WSF4527

0.455 ± 0.020

(11.56 ± 0.508)

0.167 ± 0.010

(4.24 ± 0.254)

0.100 ± 0.010

(2.54 ± 0.254)

0.275 ± 0.005

(6.98 ± 0.127)

0.215 ± 0.005

(5.46 ± 0.127)

MODEL

SOLDER PAD DIMENSIONS in inches (millimeters)

ab

l

WSF2515

0.090 (2.29)

0.115 (2.92)

0.120 (3.05)

WSF4527

0.155 (3.94)

0.230 (5.94)

0.205 (5.21)

Temperature Rise

200

150

100

50

0

0

0.5

1.0

1.5

2.0

Power in W

WSF2515

WSF4527

Derating

120

100

80

60

40

20

0

-65

-25

0

25

50

75

100

125 150 175 200

Ambient Temperature in °C

70

WSF2515

WSF4527

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

Thermal shock

-55 °C to +150 °C, 1000 cycles, 15 min at each extreme

± (1.0 % + 0.05

) R

Short time overload

5 x rated power for 5 s

± (0.5 % + 0.05

) R

Low temperature storage

-65 °C for 24 h

± (0.5 % + 0.05

) R

High temperature exposure

1000 h at +175 °C (150 °C for WSF4527)

± (1.0 % + 0.05

) R

Bias humidity

+85 °C, 85 % RH, 10 % bias, 1000 h

± (0.5 % + 0.05

) R

Moisture resistance

MIL-STD-202 method 106, 0 % power, 7a and 7b not required

± (0.5 % + 0.05

) R

Mechanical shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.05

) R

Vibration

Frequency varied 10 Hz to 500 Hz in one min, 3 directions, 9 h

± (0.5 % + 0.05

) R

Load life

1000 h at rated power, +70 °C, 1.5 h “ON”, 0.5 h “OFF”

± (1.0 % + 0.05

) R

Resistance to solder heat

+260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.05

) R

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSF2515

16 mm / embossed plastic

330 mm / 13"

2000

EA/TA

WSF4527

24 mm / embossed plastic

330 mm / 13"

1200

EA/TA