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WSM1050-R40M bảng dữ liệu(PDF) 3 Page - AiT Semiconductor Inc.

tên linh kiện WSM1050-R40M
Giải thích chi tiết về linh kiện  WIRE WOUND SMD INDUCTOR
PDF  3 Pages
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nhà sản xuất  AITSEMI [AiT Semiconductor Inc.]
Trang chủ  https://ait-ic.com/
Logo AITSEMI - AiT Semiconductor Inc.

WSM1050-R40M bảng dữ liệu(HTML) 3 Page - AiT Semiconductor Inc.

  WSM1050-R40M Datasheet HTML 1Page - AiT Semiconductor Inc. WSM1050-R40M Datasheet HTML 2Page - AiT Semiconductor Inc. WSM1050-R40M Datasheet HTML 3Page - AiT Semiconductor Inc.  
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AiT Semiconductor Inc.
www.ait-ic.com
WIRE WOUND SMD INDUCTOR
WSM
●GENERAL CHARACTERISTICS
1.
Operating temperature range: -40 TO + 85°C (Includes temperature when the coil is heated)
2.
External appearance: On visual inspection, the coil has external defects.
3.
Terminal strength: After soldering. Between copper plate and terminals of coil.
Push in two directions of X.Y withstanding at below conditions.
Terminal should not peel off. (refer to figure at right) 0.5kg
4.
Insulating resistance: Over
100MΩ at 100V D.C. between coil and core.
5.
Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core.
6.
Temperature characteristics: Inductance coefficient (0~2,000)x10-6/°C (-25~+80°C).
7.
Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95%
relative humidity at 40 ±2°C and 1 hour drying under normal condition.
8.
Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three
orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes.
9.
Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G)
shock attitude upon a rubber block method shock testing machine, in three different orientations.
10.
Resistance to Soldering Heat: 260°C, 10 seconds.
11.
Storage environment
Storage condition:
Temperature Range: 10°C ~ 35°C (Generally: 21°C ~ 31°C)
Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%)
Transportation condition:
Temperature Range: -35°C ~ 85°C, Humidity Range: 50% ~ 95% RH
12.
Use components within 6 months. If 6 months or more have elapsed, check soldarability before use.
13.
Reflow profile recommend:
Lead - free heat endurance test
Lead-free the recommended reflow condition



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