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25CSM04 bảng dữ liệu(PDF) 49 Page - Microchip Technology

tên linh kiện 25CSM04
Giải thích chi tiết về linh kiện  4-Mbit SPI Serial EEPROM with 128-Bit Serial Number and Enhanced Write Protection
PDF  55 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

25CSM04 bảng dữ liệu(HTML) 49 Page - Microchip Technology

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 2019-2022 Microchip Technology Inc. and its subsidiares
DS20005817D-page 49
25CSM04
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
Sheet 2 of 2
Overall Height
Bump Diameter
Bump Pitch
Width
Length
Bump Pitch
0.315
A
b
0.185
MIN
Dimension Limits
D
E
d2
Units
d1
MILLIMETERS
See Note 3
1.40 BSC
See Note 3
NOM
1.00 BSC
MAX
0.275
0.355
0.175
0.200
Bump Height
0.100
A1
0.085
0.115
Body Height
0.190
A2
0.175
0.205
Backside Laminate Thickness
0.025
A4
0.015
0.035
Bump Pitch
Bump Pitch
e1
e
2.10 BSC
0.50 BSC
8-Ball Wafer Level Chip Scale Package (CS) - [WLCSP]
Microchip Technology Drawing C04-21241 Rev B
3. Please contact your local Microchip representative for details.



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