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MIC45205 bảng dữ liệu(PDF) 33 Page - Microchip Technology |
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MIC45205 bảng dữ liệu(HTML) 33 Page - Microchip Technology |
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33 / 40 page ![]() 2017 - 2022 Microchip Technology Inc. DS20005798B-page 33 MIC45205 Notes: BSC: Basic Dimension. Theoretically exact value shown without tolerances. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-3055-M3A Rev A 52-Lead Very Thick Plastic Quad Flat, No Lead (M3A) - 8x8x3 mm Body [B1QFN] Micrel Legacy Package H3QFN88-52LD-PL-1 SOLDER MASK OPENING EXPOSED TRACE KEEP OUT AREA LEGEND EXPOSED METAL TRACE 7.60 7.60 0.80 0.80 0.63 2.38 2.80 0.62 0.50 Ø0.30 RECOMMENDED EXPOSED METAL TRACE EXPOSED TRACE KEEP OUT AREA RECOMMENDED SOLDER STENCIL OPENINGS 3.15 3.15 3.12 3.12 7.40 7.40 4x 0.79 2.60 1.61 0.82 2.18 0.78 4X 1.20 47X 0.25 47X 0.60 1.13 0.12 47X 0.80 EXPOSED TRACE KEEP OUT AREA SOLDER STENCIL OPENINGS EXPOSED METAL TRACES |
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