APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739

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This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.

EK21U REV I JANUARY 2005 © 2005 Apex Microtechnology Corp.

HS11 HEATSINK NOTE

The HS11 Heatsink is provided in this evaluation kit to

guar-

antee adequate thermal design through heat removal from

the part under evaluation. Once maximum power dissipation

for the application is determined (refer to “General Operating

Considerations” and Application Note 11 in the APEX DATA

BOOK), the final mechanical design will probably require sub-

stantially less heatsinking.

APEX MICROTECHNOLOGY makes no representation that

the use or interconnection of the circuits described herein will not

infringe on existing or future patent rights, nor do the descriptions

contained herein imply the granting of licenses to make, use or

sell equipment constructed in accordance therewith.

EK21

EVALUATION KIT

FOR PA74 PIN-OUT

NOTES:Refer to the following sections of the APEX DATA BOOK as noted.

1. See Stability section of “General Operating Considerations.”

2. See “Gen. Operating Considerations,” and AN3 “Bridge Circuit Drives.”

3. See Power Supplies section of “General Operating Considerations.”

4. See “Parameter Definitions and Test Methods.”

5. See Amplifier Protection section of “Gen. Operating Considerations.”