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INTRODUCTION

Fast and easy breadboarding of circuits using the PA241DF

IS possible with the EK13 evaluation kit. The amplifier may

be surface mounted directly to the PC board. The PA241DF

is soldered to a 2-square inch area of foil on the PC board for

heat sinking. This foil heat sink is connected to–Vs. Connec-

tions are provided for required power supply bypassing, phase

compensation components, and a current limit resistor. A large

area for component mounting provides flexibility and makes a

multitude of circuit configurations possible.

PARTS LIST

Part #

Description

Quantity

EVAL15

PC Board

1

OX7R105KWN

1µF Ceramic Capacitor

1

HS24

Heatsink

1

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High voltages will be present. Use caution in

handling and probing when power is applied.

CAUTION

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ASSEMBLY

The PA241DF is a surface mount device and should be

assembled to the EVAL15 PC board using surface mount

processes. Solder paste may be dispensed or screen-printed

on the DUT pads. The heat tab on the back of the PA241DF

provides maximum heat dissipation capabilities when soldered

to the PCB metalization that runs under the DUT on the DUT

side of the board. Solder should be applied here also. For

prototype purposes, the tab can be thermally connected to the

PCB metalization using thermal grease.

The PA241DF and HS24 should be reflowed to the PCB

using a solder reflow furnace. If this is not available, a heat

plate capable of solder reflow temperatures may be used. or,

though time consuming, the leads may be soldered individually

to the PCB with a soldering iron. In this case the use of thermal

grease under the heat tab is recommended instead of solder

for the thermal connection.