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PACKAGE OUTLINE

C

8X

0.32

0.18

1.6 0.1

2X

1.5

0.9 0.1

6X 0.5

8X

0.4

0.2

0.05

0.00

0.8 MAX

A

2.1

1.9

B

2.1

1.9

0.32

0.18

0.4

0.2

(0.2) TYP

WSON - 0.8 mm max height

DSG0008A

PLASTIC SMALL OUTLINE - NO LEAD

4218900/D 04/2020

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

9

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500

ALTERNATIVE TERMINAL SHAPE

TYPICAL

OPA310, OPA2310, OPA4310

SBOSAA1 – APRIL 2022

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