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STR730FZ1T7 bảng dữ liệu(PDF) 36 Page - STMicroelectronics

tên linh kiện STR730FZ1T7
Giải thích chi tiết về linh kiện  ARM7TDMI-TM 32-bit MCU with Flash, 3X CAN, 4 UARTs, 20 timers, ADC, 12 comm. interfaces
PDF  40 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STR730FZ1T7 bảng dữ liệu(HTML) 36 Page - STMicroelectronics

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Package characteristics
STR73xF
36/40
4.1.1
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
–TA is the Ambient Temperature in °C,
–
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
–PD is the sum of PINT and PI/O (PD = PINT + PI/O),
–PINT is the product of IDD and VDD, expressed in Watt. This is the Chip Internal
Power,
–PI/O represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2
(3)
Where:
–
K is a constant for the particular part, which may be determined from equation (3)
by measuring PD (at equilibrium) for a known TA. Using this value of K, the values
of PD and TJ may be obtained by solving equations (1) and (2) iteratively for any
value of TA
Table 16.
Thermal Characteristics
Symbol
Description
Package
Value (typical)
Unit
ΘJA
Thermal Resistance Junction-Ambient
LFBGA144
TBD
°C/W
TQFP144
40
TQFP100
55



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