ESDM1053 datasheet(1/6 Pages) ONSEMI

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DATA SHEET

www.onsemi.com

March, 2022 − Rev. 0

1

Publication Order Number:

ESDM1053/D

ESD Protection Diodes

Micro−packaged Diodes for ESD

Protection

ESDM1053

The ESDM1053 is designed to protect voltage sensitive components

from ESD. Excellent clamping capability, low leakage, and fast

response time provide best in class protection on designs that are

exposed to ESD. Because of its small size, it is suited for use in

smartphone, smart−watch, or many other portable / wearable

applications where board space comes at a premium.

Features

• Low Capacitance (5.5 pF Typ, I/O to GND)

• Small Body Outline Dimensions: − 01005 Size: 0.435 x 0.230 mm

• Protection for the Following IEC Standards:

IEC 61000−4−2 (Level 4)

• Low ESD Clamping Voltage

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

Operating Junction Temperature Range

TJ

−55 to +125

°C

Storage Temperature Range

Tstg

−55 to +150

°C

Lead Solder Temperature −

Maximum (10 Seconds)

TL

260

°C

ESDM1053:

IEC 61000−4−2 Contact

IEC 61000−4−2 Air

ESD

±18

kV

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

See Application Note AND8308/D for further description of

survivability specs.

PIN CONFIGURATION

AND SCHEMATIC

12

See detailed ordering and shipping information on page 2 of

this data sheet.

ORDERING INFORMATION

=

DSN2

CASE 152BB

MARKING DIAGRAM

D = Specific Device Code

D

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