Document Number: 63270

www.vishay.com

Revision: 13-Jun-11

1

This document is subject to change without notice.

Package Information

Vishay Siliconix

MICRO FOOT: 6-BUMP (3 mm x 2 mm, 0.5 mm PITCH, 165 μm BUMP HEIGHT)

Notes

(unless otherwise specified)

a. Bump is Eutectic 63/57 Sn/Pb or lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser mark on silicon die back; no coating. Shown is not actual marking; sample only.

Note

a. Use millimeters as the primary measurement.

Note

a. Use millimeters as the primary measurement.

Index-Bump A1

Note c

Top Side (Die Back)

XXX

3003

Recommended Land Pattern

0.5

0.5

6 x Ø 0.150

~ 0.229

Note b

Solder Mask Ø

~ Pad Dia. + 0.1

Silicon

Bump

Note a

b Diameter

32

1

A

B

e

D

e

A

S

S

E

EUTECTIC (Sn/Pb)

DIM.

INCHES

MIN.

MAX.

MIN.

MAX.

A

0.610

0.685

0.0240

0.0270

0.140

0.190

0.0055

0.0075

0.470

0.495

0.0185

0.0195

b

0.180

0.250

0.0071

0.0098

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0101

LEAD (Pb)-FREE (Sn/Ag/Cu)

DIM.

INCHES

MIN.

MAX.

MIN.

MAX.

A

0.688

0.753

0.0271

0.0296

0.218

0.258

0.0086

0.0102

0.470

0.495

0.0185

0.0195

b

0.306

0.346

0.0120

0.0136

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0101

ECN: S11-1065-Rev. A, 13-Jun-11

DWG: 6003