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MIC45116 bảng dữ liệu(PDF) 29 Page - Microchip Technology

tên linh kiện MIC45116
Giải thích chi tiết về linh kiện  20V/6A DC/DC Power Module
PDF  42 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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MIC45116 bảng dữ liệu(HTML) 29 Page - Microchip Technology

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2016 - 2022 Microchip Technology Inc.
DS20005571B-page 29
MIC45116
7.2
Solder Paste Stencil Design
(Recommended Stencil Thickness
= 112.5 ±12.5 µm)
The solder stencil aperture openings should be smaller
than the periphery or large PCB exposed pads to
reduce any chance of build-up of excess solder at the
large exposed pad area which can result to solder
bridging.
The suggested reduction of the stencil aperture
opening is typically 0.20 mm smaller than exposed
metal trace.
Please note that a critical requirement is to not
duplicate land pattern of the exposed metal trace as
solder stencil opening because the design and
dimension values are different.
Cyan-colored shaded pad areas indicate exposed
trace keep-out area in Figure 7-2 and Figure 7-3.
FIGURE 7-2:
Solder Stencil Opening.
FIGURE 7-3:
Stack-Up of Pad Layout and
Solder Paste Stencil.



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