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ADP2450ACPZ-3-R7 bảng dữ liệu(PDF) 9 Page - Analog Devices |
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ADP2450ACPZ-3-R7 bảng dữ liệu(HTML) 9 Page - Analog Devices |
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9 / 40 page ![]() Data Sheet ADP2450 Rev. B | Page 9 of 40 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating VIN, SW, DET, VPTH −0.3 V to +40 V AVDD −0.3 V to +6 V BST The SW pin voltage (VSW) + 6 V DRV −0.3 V to +12 V EIN1, EIN2, EIN3, EIN4 −8 V to +8 V EIN5_P, EIN5_N −8 V to +8 V EOUT1, EOUT2, EOUT3, EOUT4, EOUT5, VCOM, RCOM −0.3 V to VAVDD VREG, FB1, FB2, VTRP, VTRPL, RSTO, TRG, GATE, GAIN0, GAIN1 −0.3 V to +6 V PGNDx to GND −0.3 V to +0.3 V Operating Temperature Range (Junction) −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Electrostatic Discharge (ESD) Human Body Mode 4000 V (for EIN1, EIN2, EIN3, EIN4, EIN5_P, and EIN5_N pins), 2000 V (for the rest of pins) Charged Device Mode 500 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 6. Thermal Resistance Package Type θJA θJC Unit CP-32-71 32.7 1.4 °C/W ST-481 66.68 3.41 °C/W 1 θJA is measured using natural convection on a JEDEC 4-layer board with the exposed pad soldered to the PCB and with thermal vias. ESD CAUTION |
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