24FC64T-ESLASHMS datasheet(42/51 Pages) MICROCHIP

tên linh kiện	24FC64T-E/MS

Giải thích chi tiết về linh kiện	64-Kbit I2C Serial EEPROM

PDF	51 Pages

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nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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42 / 51 page

24AA64/24FC64/24LC64

DS20001189U-page 42

 1997-2022 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

24FC64T-E/MS bảng dữ liệu(PDF) 42 Page - Microchip Technology