SN74HCS240 datasheet(13/27 Pages) TI

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9.2.2 Detailed Design Procedure

1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the

device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout

section.

2. Ensure the capacitive load at the output is ≤ 50 pF. This is not a hard limit, however it will ensure

optimal performance. This can be accomplished by providing short, appropriately sized traces from the

SN74HCS240-Q1 to one or more of the receiving devices.

3. Ensure the resistive load at the output is larger than (VCC / IO(max)) Ω. This will ensure that the maximum

output current from the Absolute Maximum Ratings is not violated. Most CMOS inputs have a resistive load

measured in MΩ; much larger than the minimum calculated above.

4. Thermal issues are rarely a concern for logic gates; the power consumption and thermal increase, however,

can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd

Calculation.

9.2.3 Application Curve

Time (ns)

100

-2

3.3

-1

Figure 9-2. Simulated Signal Integrity at the Reciever with Different Damping Resistor (Rd) Values

10 Power Supply Recommendations

The power supply can be any voltage between the minimum and maximum supply voltage rating located in the

Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power

disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps

to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The

bypass capacitor should be installed as close to the power terminal as possible for best results, as shown in the

following layout example.

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SN74HCS240-Q1

SCLS872A – NOVEMBER 2021 – REVISED FEBRUARY 2022

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