Rev 12.20.2021

3/10

www.leiditech.com

ASM6050

6. Maximum absolute rating

project

symbol

Absolute maximum rating

unit

Input voltage

VSS-0.3 ∽ VSS+62

V

V

ON/OFF

VSS-0.3 ∽ VSS+15

V

Output voltage

VOUT

VSS-0.3 ∽ VSS+6

V

Junction temperature

-40 ∽ 170

℃

Operating ambient

temperature

Top

-40 ∽ 125

℃

Storage temperature

Tstg

-40 ∽ 125

℃

Electrostatic discharge

capacity

ESD HBM

5

kV

ESD CDM

2

kV

note:An absolute maximum rating is a rating that cannot be exceeded under any conditions.

If this rating is exceeded, physical damage such as product deterioration may be caused

.

7.Thermal resistance

Note: Chip power consumption PD = (VIN-VOUT) * Iout, the maximum power dissipation allowed by heat

dissipation conditions

8. Electrical characteristic parameters (unless otherwise specified, Ta= 25 °C).

project

symbol

condition

minimum

Typical

maximum

unit

Output voltage

VIN=13.5,Io=5mA,Ta=25°C

5.0*0.99

5.0

5.0*1.01

In

VIN=13.5V,Io=5mA, -40°C≤Ta≤125°C

5.0*0.98

5.0

5.0*1.02

In

Output current

VIN≥VOUT+2.0V

600

but

Input and output

voltage difference

Iout=100mA,Ta=25°C

0.16

In

Iout=200mA,Ta=25°C

0.32

In

Iout=500mA,Ta=25°C

0.88

In

Linear

adjustment rate

ΔVOUT1/

(ΔVIN*

VOUT)

VOUT+1.0V≤VIN≤30V ,Iout=30mA

0.005

%/V

Load regulation

rate

ΔVOUT2

VIN=13.5V,

0.1mA≤Iout≤40mA

TO-252-5

3

mV

SOT-223

6

Operating current

Iq

VIN=13.5V，ON/OFF is ON，no load,

-40°C≤He≤125°C

4.5

8.0

uA

Sleep current

Isd

VIN=13.5V，ON/OFF is OFF，

No load, -40°C≤Ta≤125°C

TO-252-5

0.14

0.5

uA

PCB conditions

Package

unit

FR4,114.3mm*76.2mm*1.6 mm

2-layer board, copper clad: 70mm *60mm*0.035mm

TO-252-5

31

°C/W

SOT-223

58

FR4,114.3mm*76.2mm*1.6 mm

4-layer board, copper clad: 70mm*60mm*0.035mm

TO-252-5

24

SOT-223

44

FR4, 50mm*50mm*1.6 mm

2-layer board, copper clad: 48mm*48mm*0.035mm

TO-252-5

37