MIC5252

DS20006579B-page 16

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2021 - 2022 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

1.45

0.85

MILLIMETERS

0.65 BSC

MIN

E

MAX

Contact Pad Length (X6)

Contact Pad Width (X6)

Y1

X1

0.75

0.30

Microchip Technology Drawing C04-21016A

NOM

6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]

SILK SCREEN

12

6

E

X1

Y1

G1

Y2

C1

0

0

.

2

g

n

i

c

a

p

S

d

a

P

t

c

a

t

n

o

C

Contact Pad to Center Pad (X6)

G1

0.20

Thermal Via Diameter

V

0.30

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Micrel Legacy Package

C1

X2

0.33

0.27