| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
MIC5209 bảng dữ liệu(PDF) 4 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MIC5209 bảng dữ liệu(HTML) 4 Page - Microchip Technology |
|
4 / 30 page ![]() MIC5209 DS20005720B-page 4 2017 - 2022 Microchip Technology Inc. and its subsidiaries 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN).................................................................................................................................... –20V to +20V Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited ESD Rating (SOT-223)..................................................................................................................... 2 kV HBM/300V MM ESD Rating (VDFN, SOIC-8) ........................................................................................................... 5 kV HBM/100V MM Operating Ratings ‡ Supply Voltage (VIN)...................................................................................................................................+2.5V to +16V Adjustable Output Voltage Range (VOUT) ..................................................................................................+1.8V to +15V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) x θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula- tor will go into thermal shutdown. See Table 4-1 and the Thermal Considerations sub-section in Applications Information for details. |
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |