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MIC5207 bảng dữ liệu(PDF) 3 Page - Microchip Technology |
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MIC5207 bảng dữ liệu(HTML) 3 Page - Microchip Technology |
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3 / 24 page ![]() 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005719C-page 3 MIC5207 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V Enable Input Voltage (VEN) ......................................................................................................................... –20V to +20V Power Dissipation (PD) (Note 1) ............................................................................................................Internally Limited Operating Ratings ‡ Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V Adjustable Output Voltage Range (VOUT).................................................................................................. +1.8V to +15V Enable Input Voltage (VEN) .................................................................................................................................0V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula- tor will go into thermal shutdown. The θJA of the SOT-23-5 (M5) is 235°C/W soldered on a PC board (see “Thermal Considerations” for further details). |
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