STPS1H100 datasheet(4/15 Pages) STMICROELECTRONICS

4 / 15 page

Figure 7. Relative variation of thermal impedance junction

to ambient versus pulse duration

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)

Single pulse

SMA Flat

SMA Flat Notch

t (s)

Figure 8. Reverse leakage current versus reverse voltage

applied (typical values)

I (µA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1 0

100

Tj=125 °C

Tj=25 °C

V (V)

Figure 9. Forward voltage drop versus forward current

(maximum values)

(A)

0.01

0.10

1.00

10.00

100.00

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Tj=25 °C

Tj=125 °C

(V)

Figure 10. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 11. Thermal resistance junction to ambient versus

copper surface under each lead

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

SMA Flat

STPS1H100

Characteristics (curves)

DS1228 - Rev 8

page 4/15

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