MIC2182 datasheet(6/40 Pages) MICROCHIP

6 / 40 page

MIC2182

DS20006644A-page 6



2022 Microchip Technology Inc. and its subsidiaries

SYNC Threshold Level

VSYNC_TH

0.7

1.3

1.9

—

SYNC Input Current

ISYNC

—

0.1

µA

VSYNC = 5V

SYNC Minimum Pulse Width

tSYNC(MIN) 200

—

SYNC Capture Range

fSYNC

330

—

kHz

Note 2

Frequency Foldback Threshold VFOLD_TH 0.75

0.95

1.15

Measured at VOUT Pin

Foldback Frequency

fFOLD

—

kHz

—

Gate Drivers

Rise/Fall Time

tR, tF

—

CLOAD = 3000 pF

Output Driver Impedance

RON_H

—

8.5

Source

RON_L

—

3.5

Sink

Driver Non-overlap Time

tNON

—

PWM Input

PWM Input Source Current

IPWM_SRC

—

–10

—

µA

VPWM = 0V

1: VIN > 1.3 x VOUT (for the feedback voltage reference and output voltage line and total regulation).

2: See the Oscillator and Sync section for limitations on the synchronizing signal frequency.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Ambient Storage Temperature Range

–65

—

+150

°C

—

Ambient Temperature Range

–40

—

+85

°C

—

Junction Temperature Range

–40

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance SOIC 16-Ld

JA

—

100

—

°C/W —

Thermal Resistance SSOP 16-Ld

JA

—

150

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VIN = 15V; SS = Open; VSHDN = 5V; ILOAD = 0.1A, TA = +25°C, Bold values indicate

–40°C ≤ TA ≤ +85°C; unless otherwise specified.

Parameter

Symbol

Min.

Typ.

Max.

Units Conditions

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