6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

Input clamp current(2)

±20

mA

Output clamp current(2)

±20

mA

Continuous output current

±35

mA

±70

mA

Junction temperature(3)

150

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

Guaranteed by design.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), pper ANSI/ESDA/JEDEC JS-002(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

5

6

V

Input voltage

0

V

Output voltage

0

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS245

UNIT

RKS (VQFN)

20 PINS

Junction-to-ambient thermal resistance

75.6

°C/W

Junction-to-case (top) thermal resistance

75.9

°C/W

Junction-to-board thermal resistance

49.6

°C/W

Junction-to-top characterization parameter

11.0

°C/W

Junction-to-board characterization parameter

48.9

°C/W

Junction-to-case (bottom) thermal resistance

32.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS245

SCLS879 – JANUARY 2022

www.ti.com

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