QPC7334

Data Sheet Rev C, October 22, 2021 | Subject to change without notice

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Evaluation board PCB: FR4, double sided, 1.5mm, 35um Cu

Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. A via drill diameter of 0.4mm and a

minimum via wall copper plating thickness of 25um is recommended. Open vias are preferred to allow flux and gases to escape during reflow

soldering and therefore to minimize voiding. Ensure good package backside paddle solder attach for reliable operation and best electrical

performance. In any case the module backside temperature should not exceed 110 °C.

Evaluation Board Assembly Drawing