MPC9259D datasheet(9/12 Pages) MOTOROLA

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MPC9259

TIMING SOLUTIONS

MOTOROLA

OUTLINE DIMENSIONS

FA SUFFIX

LQFP PACKAGE

CASE 873A-02

ISSUE A

DETAIL Y

BASE

METAL

SECTION AE–AE

SEATING

PLANE

DETAIL AD

NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2 CONTROLLING DIMENSION: MILLIMETER.

3 DATUM PLANE –AB– IS LOCATED AT BOTTOM

OF LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

5 DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

6 DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B

DO INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7 DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.520 (0.020).

8 MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9 EXACT SHAPE OF EACH CORNER MAY VARY

FROM DEPICTION.

DIM

MIN

MAX

MIN

MAX

INCHES

7.000 BSC

0.276 BSC

MILLIMETERS

7.000 BSC

0.276 BSC

1.400

1.600

0.055

0.063

0.300

0.450

0.012

0.018

1.350

1.450

0.053

0.057

0.300

0.400

0.012

0.016

0.800 BSC

0.031 BSC

0.050

0.150

0.002

0.006

0.090

0.200

0.004

0.008

0.500

0.700

0.020

0.028

12 REF

0.090

0.160

0.004

0.006

0.400 BSC

0.016 BSC

0.150

0.250

0.006

0.010

9.000 BSC

0.354 BSC

4.500 BSC

0.177 BSC

DETAIL AD

3.500 BSC

0.138 BSC

3.500 BSC

0.138 BSC

9.000 BSC

0.354 BSC

4.500 BSC

0.177 BSC

0.200 REF

0.008 REF

1.000 REF

0.039 REF

–T–

–Z–

–U–

T–U

0.20 (0.008)

T–U

0.20 (0.008)

0.10 (0.004) AC

–AC–

–AB–

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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