DLPC4430 datasheet(42/49 Pages) TI

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Figure 10-4. Layer 4

10.1.5 Thermal Considerations

The underlying thermal limitation for the DLPC4430 controller is that the maximum operating junction

temperature (TJ) not be exceeded (this is defined in the Section 6.3). This temperature is dependent on

operating ambient temperature, airflow, PCB design (including the component layout density and the amount

of copper used), power dissipation of the DLPC6421 device and power dissipation of surrounding components.

The DLPC4430 package is designed primarily to extract heat through the power and ground planes of the PCB,

thus copper content and airflow over the PCB are important factors.

The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and

is based on maximum DLPC4430 power dissipation and RθJA at 1 m/s of forced airflow, where RθJA is the

thermal resistance of the package as measured using a JEDEC defined standard test PCB. This JEDEC test

PCB is not necessarily representative of the DLPC4430 PCB, and thus the reported thermal resistance may

not be accurate in the actual product application. Although the actual thermal resistance may be different, it

is the best information available during the design phase to estimate thermal performance. However, after the

PCB is designed and the product is built, it is highly recommended that thermal performance be measured and

validated.

To do this, the top center case temperature has to be measured under the worst case product scenario (max

power dissipation, max voltage, max ambient temp) and validated not to exceed the maximum recommended

case temperature (TC). This specification is based on the measured φJT for the DLPC4430 package and

provides a relatively accurate correlation to junction temperature. Note that care must be taken when measuring

this case temperature to prevent accidental cooling of the package surface. A small (approx 40 gauge)

thermocouple is recommended. The bead and the thermocouple wire must contact the top of the package

and be covered with a minimal amount of thermally conductive epoxy. The wires must be routed closely along

the package and the board surface to avoid cooling the bead through the wires.

DLPC4430

DLPS223 – DECEMBER 2021

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DLPC4430 bảng dữ liệu(PDF) 42 Page - Texas Instruments