6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

48

V

–0.3

48

V

–48

0.3

V

Source input pin (Sx) voltage to GND

–60

60

V

–85

V

85

V

Drain pin (D or Dx) voltage

V

Logic control input pin voltage (EN, A0, A1, A2)(2)

GND –0.7

48

V

Logic control input pin current (EN, A0, A1, A2)(2)

–30

30

mA

Source or drain continuous current (Sx or D)

mA

Storage temperature

–65

150

°C

Ambient temperature

–55

150

°C

Junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Stresses have to be kept at or below both voltage and current ratings at all time.

(3)

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101(2)

All pins

±500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1)

TMUX7308F/ TMUX7309F

UNIT

PW (TSSOP)

RRP (QFN)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

100.2

43.0

°C/W

Junction-to-case (top) thermal resistance

31.2

28.8

°C/W

Junction-to-board thermal resistance

46.3

17.9

°C/W

Junction-to-top characterization parameter

1.7

0.4

°C/W

Junction-to-board characterization parameter

45.7

17.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

4.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TMUX7308F

SCDS403A – FEBRUARY 2021 – REVISED OCTOBER 2021

Copyright © 2021 Texas Instruments Incorporated

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