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TDA7576B bảng dữ liệu(PDF) 14 Page - STMicroelectronics |
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TDA7576B bảng dữ liệu(HTML) 14 Page - STMicroelectronics |
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14 / 17 page ![]() Functional description TDA7576B 14/17 Doc ID 023511 Rev 3 6 Functional description 6.1 Diagnostics pins description TDA7576B includes an offset detector pin and a clip detector and diagnostic pin. DC offset detector is intended to avoid that an anomalous DC offset on the inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on the outputs. This may lead to speakers damage due to overheating. The feature works with the amplifier unmuted and no signal at the inputs. Moreover there is a pin named CD/Diag: the behavior of this pin is showed on Figure 4. Whenever a failure condition (between thermal warning, output waveform clipping, short circuit to GND or VCC) is verified by the IC the level of this pin goes true (low). 6.2 Thermal protections Thermal protection function is triggered when junction temperature rises above the normal operating range, thus avoiding chip damaging. For behavior description, refer to Figure 4 and 12. When temperature is reaching thermal warning (Tw = typ 140 °C) the CD/Diag pin is driven low. Thermal foldback begins limiting the audio input to the amplifier stage, this effectively limits the output power capability of the device thus reducing the temperature to acceptable levels without totally interrupting the operation of the device. Thermal mute is temperature when -6 dB output attenuation is reached (typical Tm = 160 °C). The output power will decrease to the point at which thermal equilibrium is reached. Thermal equilibrium will be reached when the reduction in output power reduces the dissipated power such that the die temperature falls below the thermal foldback threshold. Figure 12. Thermal protection diagram |
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