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ADP5014ACPZ-R7 bảng dữ liệu(PDF) 7 Page - Analog Devices

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ADP5014ACPZ-R7 bảng dữ liệu(HTML) 7 Page - Analog Devices

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Data Sheet
ADP5014
Rev. A | Page 7 of 34
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
AVIN to Ground
−0.3 V to +6.5 V
PVIN1 to PGND1
−0.3 V to +6.5 V
PVIN2 to PGND2
−0.3 V to +6.5 V
PVIN3 to PGND3
−0.3 V to +6.5 V
PVIN4 to PGND4
−0.3 V to +6.5 V
SW1 to PGND1
−0.3 V to +6.5 V
SW2 to PGND2
−0.3 V to +6.5 V
SW3 to PGND3
−0.3 V to +6.5 V
SW4 to PGND4
−0.3 V to +6.5 V
PGND to Ground
−0.3 V to + 0.3 V
CFG1, CFG2 to Ground
−0.3 V to +6.5 V
EN1/ENALL, EN2/DL12, EN3/UV,
EN4/DL34 to Ground
−0.3 V to +6.5 V
GPIO to Ground
−0.3 V to +6.5 V
RT to Ground
−0.3 V to +6.5 V
VREF to Ground
−0.3 V to +6.5 V
FB1, FB2, FB3, FB4 to Ground 1
−0.3 V to +6.5 V
COMP1, COMP2, COMP3, COMP4
to Ground
−0.3 V to +6.5 V
VSET1, VSET2, VSET3, VSET4 to
Ground
−0.3 V to +6.5 V
Storage Temperate Range
−65°C to +150°C
Operational Junction Temperature
Range
−40°C to +125°C
1
The rating for the FB1, FB2, FB3, and FB4 pins applies to the adjustable
output voltage models of the ADP5014.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-40-10
40
11.1
°C/W
ESD CAUTION



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