SMD datasheet(5/8 Pages) LEIDITECH

5 / 8 page

Physical Characteristics

Terminal Materials

Tin-Plated Nickle-copper

Soldering Zone

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Moisture Sensitivity

Level 2a,

per IPC/JEDEC J-STD 020C

Environmental Specifications

Test Item

Test Conditions

Resistance Change

Passive Aging

85℃,1000 hours

±10% typical

Humidity Aging

85℃/85%RH.100 hours

±5% typical

Thermal Shock

MIL-STD-202,Method 107G

+85℃/-40℃,20 times

-30% typical

Solvent Resistance

MIL-STD-202,Method 215

No change

Vibration

ML-STD-883C,Test Condition A

No change

Electrical Specifications

IH=Hold current: Maximum current at which the device will not interrupt in 25℃ still air.

IT=Trip current: Minimum current at which the device from low resistance to high resistance in 25℃ still air.

VMAX=Maximum continuous voltage device can withstand without damage at rated current.

IMAX=Maximum fault current device can withstand without damage at rated voltage.

Maximum Time-to-trip: Maximum time to trip at assigned current.

PD=Typical power dissipation: Typical amount of power dissipated from the device when in 25℃ still air environment.

RiMIN=Minimum resistance of device at 25℃ prior to tripping.

R1MAX = Maximum device resistance is measured one hour post reflow.

Solder Reflow Profiles

Rev :

www.leiditech.com

01.06.2018

5/8

SMD1210P150L~750L Series

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