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ASL5015FHV bảng dữ liệu(PDF) 69 Page - NXP Semiconductors

tên linh kiện ASL5015FHV
Giải thích chi tiết về linh kiện  Matrix LED Controller (MLC)
PDF  69 Pages
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ASL5015FHV bảng dữ liệu(HTML) 69 Page - NXP Semiconductors

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NXP Semiconductors
ASL5xxxyHz
Matrix LED Controller (MLC)
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 February 2019
Contents
1
General description ............................................ 1
2
Features ............................................................... 3
3
Applications .........................................................3
4
Orderable parts ................................................... 4
5
Application diagram ............................................5
6
Block diagram ..................................................... 6
7
Pinning information ............................................ 7
7.1
Pinning – HVQFN36 package ........................... 7
7.2
Pin description – HVQFN36 package ................ 7
7.3
Pinning – HLQFP48 package ............................9
7.4
Pin description – HLQFP48 package .................9
8
Functional description ......................................11
8.1
Integrated switches for single or multiple
LEDs dimming ................................................. 11
8.2
LED current capability and power dissipation ...13
8.3
Internal PWM dimming generator and phase
shifting ..............................................................13
8.4
Programming and execution of PWM
dimming – ASL50xxyHz .................................. 15
8.4.1
Channel programming registers map ...............17
8.5
Delay coefficient – ASL50xxyHz ......................20
8.6
Diagnostics ...................................................... 20
8.6.1
Direct NTC input ..............................................20
8.6.2
Direct Identification resistor input .....................21
8.6.3
LED fault detection .......................................... 21
8.6.4
Internal junction temperature warnings ............22
8.6.5
Undervoltage detection and protection ............ 22
8.6.6
Diagnosis registers map .................................. 22
8.6.6.1
Register 34h - Status register ..........................22
8.6.6.2
Read diagnostic bits, from MLC to
microcontroller ................................................. 24
8.7
Internal oscillator 200 MHz for digital blocks .... 26
8.8
Charge Pump .................................................. 27
8.9
Charge pump fail-safe operation mode
(CPFSO) .......................................................... 27
8.10
Matrix LED controller interface and
configuration .................................................... 28
8.11
External IC addressing .................................... 29
8.12
Protection against missing VCC ...................... 29
8.13
LED brightness calibration factor .....................29
8.14
Limp Home mode operation ............................ 30
8.14.1
Limp Home mode activation ............................31
8.14.2
Limp Home mode operation ............................ 31
8.14.3
Limp Home mode deactivation ........................ 31
8.15
Communication interface ................................. 32
8.16
Application protocol ......................................... 33
9
CAN commands ................................................ 34
10
ASL50xxyHz Register map ...............................38
11
Direct PWM mode – ASL51xxyHz. ...................40
11.1
ASL51xxSHy Register MAP ............................ 40
12
Sleep and Wake Up .......................................... 41
13
Partial networking for Sleep and Wake Up
(message based) ...............................................42
13.1
CAN message configuration for Partial_
Sleep and Partial_Wake .................................. 43
14
Nonvolatile
Multitime
Programmable
Memory (MTP) ................................................... 43
14.1
MTP memory map ...........................................44
14.1.1
Registers value selection criteria .....................46
15
Limiting values ..................................................49
16
Thermal characteristics ....................................51
17
Static characteristics ........................................51
18
Dynamic characteristics ...................................53
19
Packaging .......................................................... 54
19.1
Package mechanical dimensions .................... 54
20
Revision history ................................................ 65
21
Legal information ..............................................66



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