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ICS8530DYI01 bảng dữ liệu(PDF) 12 Page - Integrated Circuit Systems

tên linh kiện ICS8530DYI01
Giải thích chi tiết về linh kiện  LOW SKEW, 1-TO-16 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
PDF  17 Pages
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nhà sản xuất  ICST [Integrated Circuit Systems]
Trang chủ  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS8530DYI01 bảng dữ liệu(HTML) 12 Page - Integrated Circuit Systems

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8530DYI-01
www.icst.com/products/hiperclocks.html
REV. A FEBRUARY 25, 2005
12
Integrated
Circuit
Systems, Inc.
ICS8530I-01
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
PRELIMINARY
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERM AL VIA
SOLDER M ASK
FIGURE 4. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in
Figure 4. For further information, please re-
fer to the Application Note on Surface Mount Assembly of
Amkor’s Thermally /Electrically Enhance Leadframe Base Pack-
age, Amkor Technology.



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