ADRF6521 datasheet(7/33 Pages) AD

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Data Sheet

ADRF6521

Rev. 0 | Page 7 of 33

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltages: VPOS − VNEG

5.25 V

PWD

VNEG + 3.3 V

INP1, INM1, INP2, and INM2

VPOS + 0.5 V

OPP1, OPM1, OPP2, and OPM2

VPOS + 0.5 V

OFS1, OFS2

VPOS + 0.5 V

VOCM

VPOS + 0.5 V

VGN

VPOS + 0.5 V

Internal Power Dissipation

1.53 W

Temperature

Maximum Junction

125°C

Operating Range

−40°C to +85°C

Storage Range

−65°C to +150°C

Lead (Soldering 60 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

θJA1

θJC2

Unit

CP-20-19

62.25

52.8

°C/W

Based on simulation with JEDEC Standard JESD-51, using a 2S2P board.

Based on simulation with JEDEC Standard JESD-51, using a 1S0P board.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per

ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRF6521

Table 4. ADRF6521, 20-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±1000

FICDM

±1250

ESD CAUTION

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