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ADL6316ACCZ-R7 bảng dữ liệu(PDF) 6 Page - Analog Devices

tên linh kiện ADL6316ACCZ-R7
Giải thích chi tiết về linh kiện  500 MHz to 1000 MHz Transmit VGA for Use with RF DACs and Transceivers
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ADL6316ACCZ-R7 bảng dữ liệu(HTML) 6 Page - Analog Devices

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ADL6316
Data Sheet
Rev. 0 | Page 6 of 37
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
V50AMP1, V50AMP2
−0.3 V to +5.5 V
V33FUSE
−0.3 V to +3.6 V
VDAC
−0.3 V to +3.6 V
VVA_ANALOG
−0.3 V to +3.6 V
CS, SCLK, SDI, SDO, CS4, CS5, TXEN
−0.3 V to +3.6 V
RF Input Power (IN_N, IN_P) at 50 Ω
10 dBm
Operating Temperature Range
(Measured at Exposed Pad)
−40°C to +105°C
Junction Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the conduction thermal resistance from junction to case where
the case temperature is measured at the bottom of the package.
The thermal resistance values specified in Table 5 are simulated
based on JEDEC specifications (unless specified otherwise) and
should be used in compliance with JESD51-12.
Table 5. Thermal Resistance1, 2
Package Type
θJA
θJC BOTTOM
Unit
CC-38-1
21.4
7.6
°C/W
1
For θJCBOTTOM, the case bottom is controlled at 105°C and the case top is
controlled at 100°C.
2
Using enhanced heat removal (for example, PCB, heat sink, and airflow)
techniques to improve thermal resistance values.
ESD CAUTION



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