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DA7280 bảng dữ liệu(PDF) 73 Page - Dialog Semiconductor

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Giải thích chi tiết về linh kiện  LRA/ERM Haptic Driver with Multiple Input Triggers, Integrated Waveform Memory and Wideband Support
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DA7280
LRA/ERM Haptic Driver with Multiple Input Triggers,
Integrated Waveform Memory and Wideband Support
Datasheet
Revision 3.0
30-Jul-2019
CFR0011-120-00
73 of 76
© 2019 Dialog Semiconductor
7.3
Moisture Sensitivity Level
The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor
lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be
exposed to an environment with a specified maximum temperature and a maximum relative humidity
before the solder reflow process. The MSL classification is defined in Table 76.
For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be
downloaded from http://www.jedec.org.
The WLCSP package is qualified for MSL 1.
The QFN package is qualified for MSL 3.
Table 76: MSL Classification
MSL Level
Floor Lifetime
Conditions
MSL 4
72 hours
30 °C / 60 % RH
MSL 3
168 hours
30 °C / 60 % RH
MSL 2A
4 weeks
30 °C / 60 % RH
MSL 2
1 year
30 °C / 60 % RH
MSL 1
Unlimited
30 °C / 85 % RH
7.4
WLCSP Handling
Manual handling of WLCSP packages should be reduced to the absolute minimum. In cases where it
is still necessary, a vacuum pick-up tool should be used. In extreme cases plastic tweezers could be
used, but metal tweezers are not acceptable, since contact may easily damage the silicon chip.
Removal of a WLCSP package will cause damage to the solder balls. Therefore, a removed sample
cannot be reused.
WLCSP packages are sensitive to visible and infrared light. Precautions should be taken to properly
shield the chip in the final product.
7.5
Soldering Information
Refer to the IPC/JEDEC standard J-STD-020 for relevant soldering information. This document can
be downloaded from http://www.jedec.org.



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