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NGTP25N140FST4G bảng dữ liệu(PDF) 6 Page - ON Semiconductor |
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NGTP25N140FST4G bảng dữ liệu(HTML) 6 Page - ON Semiconductor |
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6 / 10 page ![]() AND9068/D http://onsemi.com 5 Forward Transconductance, gfs This is the amount of change in collector current for an incremental change in the gate to emitter voltage, measured in Siemens (or Mhos). It is specified at the room temperature rated current of the device, and typically with the device in full saturation, where a further increase in collector−emitter voltage no longer leads to an additional increase in collector current. A typical collector−emitter voltage used for this test is 20 V. Figure 5 illustrates the gfs measurement. Figure 5. Illustration of the Measurement of IGBT gfs Dynamic Characteristics Table 4. IGBT Dynamic Electrical Characteristics Parameter Test Conditions Symbol Min Typ Max Unit DYNAMIC CHARACTERISTIC Input capacitance VCE = 20 V, VGE = 0 V, f = 1 MHz Cies − 2600 − pF Output capacitance Coes − 64 − Reverse transfer capacitance Cres − 42 − Gate charge total VCE = 480 V, IC = 15 A, VGE = 15 V Qg 80 nC Gate to emitter charge Qge 24 Gate to collector charge Qgc 33 The dynamic electrical characteristics which include device capacitances and gate charge are given in the electrical table, as shown in Table 4. IGBT capacitances are similar to those described for power MOSFETs. The datasheet describes the measurable terminal capacitances, Cies, Coes, and Cres. They are specified in the electrical table at a fixed collector bias voltage; however, the capacitances are voltage dependant, as can be seen in Figure 6. The capacitances specified on the datasheet are convenient and easily measured. They relate to the pin to pin capacitances shown in Figure 7 and described below. VCE, COLLECTOR−TO−EMITTER VOLTAGE (V) Cies Coes Cres VGE = 0 V, f = 1 MHz 10000 1000 100 10 0 10 20 30 100 40 60 80 90 70 50 Figure 6. IGBT Capacitance versus Collector−Emitter Voltage Showing Voltage Dependance of Coes and Cres |
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