ADPA7006CHIP datasheet(5/24 Pages) AD

5 / 24 page

Data Sheet

ADPA7006CHIP

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Drain Bias Voltage (VDDxx)

6.0 V

Gate Bias Voltage (VGG1)

−1.5 V to 0 V

Radio Frequency (RF) Input Power (RFIN)

20 dBm

Continuous Power Dissipation (PDISS),

T = 85°C (Derate 92.6 mW/°C

Above 85°C)

8.3 W

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−55°C to +85°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Class 1B Passed,

750 V

Reliability Information

Junction Temperature to Maintain

1,000,000 Hour Mean Time to Failure

(MTTF)

175°C

Nominal Junction Temperature (T = 85°C,

VDD = 5 V, IDQ = 800 mA)

128.2°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to system design and

operating environment. Careful attention to the printed circuit

board (PCB) thermal design is required. θJC is the channel to

case thermal resistance, channel to bottom of die using die

attach epoxy.

Table 6. Thermal Resistance

Package Type

θJC

Unit

C-14-7

10.8

°C/W

ESD CAUTION

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