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AT24CSW01X bảng dữ liệu(PDF) 33 Page - Microchip Technology

tên linh kiện AT24CSW01X
Giải thích chi tiết về linh kiện  I짼C-Compatible (Two-Wire) Serial EEPROM with a Security Register and Software Write Protection 1?멚bit (128 x 8), 2?멚bit (256 x 8)
PDF  41 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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AT24CSW01X bảng dữ liệu(HTML) 33 Page - Microchip Technology

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For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
(c)
L
L1
θ
VIEW A-A
SHEET 1
protrusions shall not exceed 0.25mm per side.
1.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2.
Foot Angle
Number of Leads
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Lead Width
Notes:
L1
θ
b
c
Dimension Limits
E
E1
D
L
e1
A
A2
A1
Units
N
e
0°
0.08
0.30
-
-
-
8°
0.20
0.50
MILLIMETERS
0.95 BSC
1.90 BSC
0.30
-
0.70
-
0.60 REF
2.90 BSC
-
2.80 BSC
1.60 BSC
0.90
-
-
MIN
5
NOM
1.10
1.00
0.10
0.60
MAX
REF: Reference Dimension, usually without tolerance, for information purposes only.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2
5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]
Atmel Legacy Global Package Code TSZ
AT24CSW01X/AT24CSW02X
Packaging Information
© 2020-2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS20006396B-page 33



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