Figure 5-6. Top-Layer Pin Geometry

0.8048[31.6850]

Paste

Metal

Mask

0.6209[24.4449]

0.0254[1.0000]

0.0356[1.4016]

0.7523[29.6181]

Note: The contract manufacturer has latitude to modify the solder paste stencil for manufacturability reasons. The

solder paste stencil covers 65% to 80% of the thermal pad and should not allow solder to be applied to the thermal

vias under the QFN package using any method they deem appropriate. Any design should be subject to system

validation and qualification prior to commitment to mass production of field deployment. Use a 5 mil stencil.

5.4

Recommended Solder Reflow Information

RoHS 6/6

Pb-free 100% Matte Tin Finish

Package Peak Temperature for Solder Reflow (40 s maximum exposure)—260 °C (0 °C, –5 °C)

PD69208T4/PD69204T4/PD69208M

Package Information

Datasheet

DS00003428C-page 26