HMC6505ALC5TR-R5 datasheet(4/30 Pages) AD

4 / 30 page

HMC6505A

Data Sheet

Rev. 0 | Page 4 of 30

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Drain Bias Voltage (VDD1, VDD2, and VDD3)

5.5 V

Gate Bias Voltage

VGG

−3 V to 0 V

VCTRL

−5 V to +0.3 V

Input Power

10 dBm

20 dBm

Moisture Sensitivity Level (MSL) Rating1

MSL3

Maximum Junction Temperature

175°C

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Reflow Temperature

260°C

Electrostatic Discharge Sensitivity

Human Body Model (HBM)

500 V

Field Induced Charged Device Model

(FICDM)

750 V

See the Ordering Guide.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-32-11

66.7

54.6

°C/W

Thermal impedance simulated values are based on JEDEC 2S2P test board

with 5 × 5 thermal vias. Refer to JDEC standard JESD51-2 for additional

information.

ESD CAUTION

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