MPC755 datasheet(35/56 Pages) NXP

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

Package Description

7.5

Package Parameters for the MPC755 PBGA

The package parameters are as provided in the following list. The package type is 25

× 25 mm, 360-lead

plastic ball grid array (PBGA).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.22 mm

Maximum module height

2.77 mm

Ball diameter

0.75 mm (29.5 mil)

7.6

Mechanical Dimensions for the MPC755

Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC755, 360

PBGA package.

Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,

360 PBGA Package

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

0.2

360X

A1 CORNER

0.2

123456789 10 111213141516

0.3

0.15

0.2 C

171819

Millimeters

DIM

Min

Max

2.22

2.77

0.50

0.70

1.00

1.20

—0.60

0.60

0.90

25.00 BSC

6.75

25.00 BSC

7.87

1.27 BSC

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