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TL072CD bảng dữ liệu(PDF) 14 Page - Texas Instruments

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6.8 Thermal Information: TL071x
THERMAL METRIC(1)
TL071x
UNIT
D (SOIC)
P (PDIP)
PS (SO)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
97
85
95
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
—
—
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.9 Thermal Information for Dual Channel: TL072H
THERMAL METRIC (1)
TL072H
UNIT
D
(SOIC)
DDF
(SOT-23)
PW
(TSSOP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
147.8
181.5
200.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
88.2
112.5
89.4
°C/W
RθJB
Junction-to-board thermal resistance
91.4
98.2
131.0
°C/W
ψJT
Junction-to-top characterization parameter
36.8
17.2
22.2
°C/W
ψJB
Junction-to-board characterization parameter
90.6
97.6
129.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.10 Thermal Information: TL072x
THERMAL METRIC(1)
TL072x
UNIT
D (SOIC)
JG (CDIP)
P (PDIP)
PS (SO)
8 PINS
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
97
—
85
95
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
—
15.05
—
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
TL071, TL071A, TL071B, TL071H
TL072, TL072A, TL072B, TL072H, TL072M
TL074, TL074A, TL074B, TL074H, TL074M
SLOS080S – SEPTEMBER 1978 – REVISED JULY 2021
www.ti.com
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TL071 TL071A TL071B TL071H TL072 TL072A TL072B TL072H TL072M TL074 TL074A
TL074B TL074H TL074M



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