6.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

OPA2992, OPA2992S

UNIT

D(2)

(SOIC)

DDF(2)

(SOT-23-8)

DGK(2)

(VSSOP)

DGS(2)

(VSSOP)

DSG

(WSON)

PW(2)

(TSSOP)

RUG(2)

(X2QFN)

8 PINS

8 PINS

8 PINS

10 PINS

8 PINS

8 PINS

10 PINS

Junction-to-ambient

thermal resistance

138.7

TBD

TBD

TBD

TBD

188.4

TBD

°C/W

Junction-to-case (top)

thermal resistance

78.7

TBD

TBD

TBD

TBD

77.1

TBD

°C/W

Junction-to-board thermal

resistance

82.2

TBD

TBD

TBD

TBD

119.1

TBD

°C/W

Junction-to-top

characterization

parameter

27.8

TBD

TBD

TBD

TBD

14.2

TBD

°C/W

Junction-to-board

characterization

parameter

81.4

TBD

TBD

TBD

TBD

117.4

TBD

°C/W

Junction-to-case (bottom)

thermal resistance

N/A

TBD

TBD

TBD

TBD

N/A

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for OPA2992.

6.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

OPA4992, OPA4992S

UNIT

D(2)

(SOIC)

PW(2)

(TSSOP)

RTE(2)

(WQFN)

RUC(2)

(WQFN)

14 PINS

14 PINS

16 PINS

16 PINS

14 PINS

Junction-to-ambient thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-top characterization parameter

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board characterization

parameter

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (bottom) thermal

resistance

TBD

TBD

TBD

TBD

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for OPA4992.

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OPA992, OPA2992, OPA4992

SBOSA10 – JUNE 2021

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