công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

MCP661 bảng dữ liệu(PDF) 20 Page - Microchip Technology

tên linh kiện MCP661
Giải thích chi tiết về linh kiện  60 MHz, 32 V/關s Rail-to-Rail Output (RRO) Op Amps
PDF  68 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP661 bảng dữ liệu(HTML) 20 Page - Microchip Technology

Back Button MCP661 Datasheet HTML 16Page - Microchip Technology MCP661 Datasheet HTML 17Page - Microchip Technology MCP661 Datasheet HTML 18Page - Microchip Technology MCP661 Datasheet HTML 19Page - Microchip Technology MCP661 Datasheet HTML 20Page - Microchip Technology MCP661 Datasheet HTML 21Page - Microchip Technology MCP661 Datasheet HTML 22Page - Microchip Technology MCP661 Datasheet HTML 23Page - Microchip Technology MCP661 Datasheet HTML 24Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 20 / 68 page
background image
MCP660/1/2/3/4/5/9
DS20002194E-page 20
 2009-2014 Microchip Technology Inc.
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN-, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In that case, VSS is connected to
Ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select Digital Input (CS)
The input (CS) is a CMOS, Schmitt-triggered input that
places the part into a low-power mode of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the exposed
thermal pad (EP) and the VSS pin; they must be
connected to the same potential on the printed circuit
board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68


bảng dữ liệu tải về

Go To PDF Page


Link URL



Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không?  [ DONATE ] 

Alldatasheet là   |   Quảng cáo   |   Liên lạc với chúng tôi   |   Chính sách bảo mật   |   Liên kết đến bảng dữ liệu    |   Trao đổi link   |   Tìm kiếm theo nhà sản xuất
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com