MCP3464 datasheet(98/108 Pages) MICROCHIP

tên linh kiện	MCP3464

Giải thích chi tiết về linh kiện	Two/Four/Eight-Channel, 153.6 ksps, Low Noise, 16-Bit Delta-Sigma ADC

PDF	108 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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98 / 108 page

MCP3461/2/4

DS20006180D-page 98

 2019-2021 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

1.80

MILLIMETERS

0.40 BSC

MIN

MAX

3.00

Contact Pad Length (X20)

Contact Pad Width (X20)

0.80

0.20

Microchip Technology Drawing C04-2264A

NOM

SILK SCREEN

Contact Pad Spacing

3.00

Contact Pad to Center Pad (X20)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

20-Lead Ultra Thin Plastic Quad Flat, No Lead Package

- 3x3 mm Body [UQFN]

(Formerly Q3DE; SST Legacy Package)

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