Package Information

www.vishay.com

Vishay Siliconix

Revision: 29-Dec-14

1

Document Number: 65224

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

WLCSP9 3 x 3 (9 Bumps) POD (for 17 mil Die thickness)

Notes (unless otherwise specified)

1. Laser mark on the silicon die back, coated with an epoxy film.

2. Bumps are SAC396.

3. 0.050 mm max. co-planarity.

4. Laminate tape thickness is 0.022 mm.

5. Use millimeters as the primary measurement

DIM.

MILLIMETERS

INCHES

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

0.600

0.620

0.640

0.0236

0.0244

0.0252

A1

0.144

0.170

0.196

0.0057

0.0067

0.0077

b

0.220

0.250

0.280

0.0087

0.0098

0.0110

e

0.400

0.0157

s

0.205

0.225

0.245

0.0081

0.0089

0.0096

D

1.220

1.250

1.280

0.0480

0.0492

0.0504

E

1.220

1.250

1.280

0.0480

0.0492

0.0504

s

e

s

e

E

Y W L

AB C

Index Bump A1

A1

B1

C1

A2

A3

B2

B3

C2

C3

Top View

Bottom View

Side View

Bump Note 2

Recommanded

Land Pattern

(NSMD)

e

A1

e

9x Ø b

9x 0.22 mm Cu pad

solder mask Ø 0.32 mm

T14-0805-Rev. A, 29-Dec-14

DWG: 6030