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STSPIN32F0601Q bảng dữ liệu(PDF) 9 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  Advanced 600 V three-phase BLDC controller with embedded STM32 MCU
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4.2
Thermal data
Table 5. Thermal data
Symbol
Parameter
Value
Unit
Rth(JA)
Thermal resistance junction to ambient(1)
TQFP 10x10 64L package
27.6
°C/W
Thermal resistance junction to ambient (1)
QFN 10x10 72L package
22.4
1. JEDEC 2s2p PCB in still air.
4.3
Recommended operating conditions
Table 6. Recommended operating conditions
Symbol
Parameter
Test Condition
Min
Typ
Max
Unit
VCC
Power supply voltage
(VCCthON)MAX
20
V
VLS (1)
Low-side driver supply voltage
4
20
V
VPS (2)
Low-side driver ground
-5
5
V
VBO(3)
Floating supply voltage
(VBOthON)MAX
20
V
VCIN
Comparator input voltage
0
15
V
VOUT
DC Output voltage
-10(4)
580
V
FSW
Maximum switching frequency
(5)
800
kHz
VDD
Standard MCU operating
voltage
3.0
3.3
3.6
V
VDDA
MCU analog operating voltage
(ADC not used)
Must have a potential equal to
or higher than VDD
VDD
3.6
V
MCU analog operating voltage
(ADC used)
VDD
3.6
V
TJ
Operating junction temperature
-40
125
°C
1. VLS = VCC - VPGND
2. VPS = VPGND - VSGND
3. VBO = VBOOT - VOUT
4. LVG off. VCC = 9 V. Logic is operational if VBOOT > 5 V
5. Actual maximum FSW depends on power dissipation.
STSPIN32F0601, STSPIN32F0602
Thermal data
DS12981 - Rev 5
page 9/32



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