ADMV7310BCEZ datasheet(27/29 Pages) AD

27 / 29 page

Data Sheet

ADMV7310

Rev. A | Page 27 of 29

LAYOUT

Solder the exposed pad on the underside of the ADMV7310 to a

low thermal and electrical impedance ground plane. This pad

is typically soldered to an exposed opening in the solder mask.

Connect these ground vias to all other ground layers to

maximize heat dissipation from the device package.

Figure 84 illustrates the recommended mechanical layout on the

interface plate used to interface to the WR-12 waveguide

opening of the ADMV7310. The recommended PCB land

pattern footprint is shown in Figure 85.

NOTES:

1. REMOVE BURRS AND BREAK SHARP EDGES.

2. ALL INTERNAL RADII ARE 0.090 UNLESS OTHERWISE NOTED.

3. SURFACE FINISH 32 RMS UNLESS OTHERWISE SPECIFIED.

4. DIMENSIONS APPLY AFTER PLATING.

5. MATERIAL: ALUMINUM 6061-T6 PER QQ-A-250/11.

6. FINISH: NONE.

7. INSTALL DOWEL PINS.

8. USE ELECTRONIC DATA FOR ALL GEOMETRY THAT IS NOT DIMENSIONED.

(Ø0.563)

2× Ø0.0595±0.0005 THRU

MARKED A

2× Ø0.067±0.003 THRU

MARKED B

NOTE: 7

PRESS FIT ALIGNMENT PINS (QTY 2)

TO HEIGHT SHOWN THIS SIDE

4× R0.016

0.981

0.761

0.639

2× 0.899

2× 0.501

0.419

0.061 (1.55)

0.122 (3.10)

0.000

PART LIST

ITEM

QTY

VENDOR

VARIOUS

STOCK NUMBER

VARIOUS

DESCRIPTION

PIN, ALIGNMENT, FLANGE, 0.0615 DIA

DETAIL A

Figure 84. Recommended Standard WR-12 Footprint

NOTES

1. WAVEGUIDE OPENING TO BE FULLY EDGE PLATED.

2. FILL AREA UNDER DEVICE WITH AN ARRAY OF

0.010 INCH VIAS (FILLED, RECOMMENDED 0.025 INCH PITCH).

DETAIL A

WAVEGUIDE

0.014

(0.36)

0.120

(3.05)

0.031

(0.80)

0.280

(7.10)

0.173

(4.40)

0.559

(14.20)

0.208

(5.29)

0.319

(8.10)

0.022

(0.55)

0.110

(2.80)

0.122

(3.10)

0.061

(1.55)

0.044

(1.11)

0.049

(1.24)

0.014

(0.35)

R0.010

(R.25)

0.546

(13.88)

0.016

(0.40)

0.079

(2.00)

0.037

(0.95)

0.185

(4.70)

0.132

(3.35)

0.124

(3.14)

0.225

(5.73)

0.102

(2.60)

0.041

(1.05)

PCB SOLDERMASK KEEPOUT

PCB SOLDER PASTE MASK

PCB METAL FOOTPRINT

0.085

(2.15)

0.124

(3.15)

0.185

(4.70)

0.012

(0.30)

0.124

(3.15)

0.372

(9.45)

0.186

(4.73)

0.061

(1.55)

SEE

DETAIL A

Figure 85. PCB Land Pattern Footprint

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