ADGS5414BCPZ datasheet(13/30 Pages) AD

13 / 30 page

Data Sheet

ADGS5414

Rev. 0 | Page 13 of 30

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 8.

Parameter

Rating

VDD to VSS

48 V

VDD to GND

−0.3 V to +48 V

VSS to GND

+0.3 V to −48 V

VL to GND

−0.3 V to +5.75 V

Analog Inputs1

VSS − 0.3 V to VDD + 0.3 V or

30 mA, whichever occurs first

Digital Inputs1

−0.3 V to +5.75 V

Peak Current, Sx or Dx Pins

422 mA (pulsed at 1 ms, 10%

duty cycle maximum)

Continuous Current, Sx or Dx

Pins2

Data (see Table 5 and Table 6) +

15%

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Reflow Soldering Peak

Temperature, Pb Free

260(+0 or −5)°C

Human Body Model (HBM)

Electrostatic Discharge (ESD)

8 kV

1 Overvoltages at the Sx and Dx pins are clamped by internal diodes. Limit

current to the maximum ratings given.

2 See Table 5 and Table 6.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Only one absolute maximum rating can be applied at any

one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 9. Thermal Resistance

Package Type

θJA

θJC2

Unit

CP-24-171

3.28

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51.

2 θJCB is the junction to the bottom of the case value.

ESD CAUTION

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