V60DM100C

www.vishay.com

Vishay General Semiconductor

Revision: 18-Mar-2019

4

Document Number: 87578

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 7 - Thermal Resistance Junction-to-Ambient vs.

Copper Pad Areas

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

25

30

35

40

45

50

55

123456789

Epoxy printed circuit

board FR4 copper

thickness = 70 μm

(8.99)

0.059 (1.50) REF.

(8.59)

0.354

0.338

(8.60)

(8.20)

0.339

0.323

(10.20)

(9.80)

0.402

0.386

(12.93)

(12.33)

0.509

0.485

(1.60)

(1.20)

0.063

0.047

(1.21)

(0.81)

0.048

0.032

(0.52)

(0.27)

0.020

0.011

(1.80)

(1.60)

0.071

0.063

(1.74)

(1.34)

0.069

0.053

(0.52)

(0.27)

0.020

0.011

(1.23)

(0.72)

0.052

0.028

(7.00)

(6.60)

0.276

0.260

Mounting Pad Layout

0.420 (10.66) MIN.

(15.33)

(13.33)

0.604

0.525

0.080 (2.03) MIN.

0.120 (3.05) REF.

(2.67)

(2.41)

0.105

0.095

SMPD (TO-263AC)

NOM.

0.194

(4.93)

NOM.

0.200

(5.08)

0 to 0.01

(0 to 0.254)

REF.

0.330

(8.38)