LTC4381

23

Rev. 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

5.00 ±0.10

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE

OUTLINE M0-220 VARIATION WHKD

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

2

1

31

32

BOTTOM VIEW—EXPOSED PAD

6.30 ±0.10

7.00 ±0.10

0.75 ± 0.05

R = 0.125

TYP

0.00 – 0.05

0.17 ±0.05

(DKE32) QFN 0819 REV A

0.40 BSC

0.200 REF

6.0 REF

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.75 REF

0.51 REF

0.40 ±0.10

0.70 ±0.05

0.40 BSC

6.00 REF

4.10 ±0.05

5.50 ±0.05

0.17 ±0.05

6.30 ±0.05

2.94 ±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35 × 45° CHAMFER

DKE Package

32-Lead Plastic DFN (7mm × 5mm)

(Reference LTC DWG # 05-08-1789 Rev A)

2.94 ±0.10