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ESDL4151 bảng dữ liệu(PDF) 2 Page - ON Semiconductor |
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ESDL4151 bảng dữ liệu(HTML) 2 Page - ON Semiconductor |
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2 / 7 page ![]() Bi−Directional Surge Protector IPP IPP V I IR IT IT IR VRWM VC VBR VRWM VC VBR ESDL4151 www.onsemi.com 2 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current *See Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Conditions Min Typ Max Unit Reverse Working Voltage VRWM I/O Pin to GND 15 V Breakdown Voltage VBR IT = 1 mA, I/O Pin to GND 15.5 16.6 19.5 V Reverse Leakage Current IR @ 3.3 V, I/O Pin to GND @ 15 V, I/O Pin to GND 0.1 1.0 mA Clamping Voltage VC Per IEC61000−4−2, ±8 kV Contact See Figures 1 & 2 V Clamping Voltage TLP (Note 1) VC IPP = 8 A IEC61000−4−2 Level 2 Equivalent (±4 kV Contact, ±8 kV Air) 21.3 V IPP = 16 A IEC61000−4−2 Level 4 Equivalent (±8 kV Contact, ±16 kV Air) 22.9 V Reverse Peak Pulse Current IPP IEC61000−4−5 (8x20 ms) Input Voltage 53 V IEC61000−4−5 (8x20 ms) per Figure 11 11 A Clamping Voltage 8x20 ms Waveform per Figure A (Note 2) VC IEC61000−4−5 (8x20 ms) Input Voltage = 53 V 23 26 V Dynamic Resistance RDYN I/O Pin to GND (8x20 ms) 0.43 W Junction Capacitance CJ VR = 0 V, f = 1 MHz 0.80 1.0 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50, tp = 100 ns, tr = 1 ns, averaging window; t1 = 70 ns to t2 = 90 ns. 2. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−5 waveform. |
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